Machining Facilities
Our machining facilities include a wide range of machining equipment to handle a variety of products used in the fields of semiconductors, LCD(liquid crystal displays) , solar and analytics equipment.
We have also aggressively introduced the latest machining equipment to handle the increases in the size of LCD(liquid crystal displays)in recent years.
◆ Laser cutting ◆
Utilizing a carbon gas laser, this laser can drill and cut quartz into freely formed curved lines.
◆ Double-Sided Lapping Machine ◆
This double-sided lapping/polishing machine can simultaneously lap/polish both sides of plate or ring-shaped products. This allows high-precision machining of flat, parallel surfaces.


◆Please feel free to contact us with any questions.


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